2003•Transactions of the China Welding InstitutionRequires access
Diffusion bonding of TiB_2 cermet to TiAl intermetallic
Zhuo Li, Feng Ji
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Abstract
The diffusion bonding of TiB 2 cermet to TiAl intermetallic was studied in this paper.The effects of bonding parameters on the microstructure of the joints and mechanical properties was investigated.The results showed that a Ti(Cu,Al) 2 intermetallic layer was formed at the interface between TiB 2 cermet and TiAl intermetallic when directly diffusion bonding.A TiAlNi 2 intermetallic layer and two Ti,Al,Ni solid solution layers were formed at the interface by using Ni interlayer.The shear strength was 103 MPa when directly diffusion bonding with bonding temperature T =1 223 K,bonding time t =1.8 ks and bonding pressure p =80 MPa,and the shear strength was 110 MPa by using Ni layer with T = 1 223 K, t =1.8 ks and p =80 MPa.