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Taiwan foundry for System-In-Package (SIP)

Albert Lin

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Abstract

System-In-Package (SIP) is a cost-effective alternative to System-On-Chip (SOC) and chips with embedded memory, The key elements of SIP technology include I/O redistribution, solder bumping, flip chip assembly, and high density thin film interconnect substrate with/without integrated passives. To meet the need of SIP, as well as other advanced packaging solutions, APack Technologies has been set up to serve worldwide customers. The high quality of the APack service is built upon SIP technology licensed from Bell Labs of Lucent Technologies, and the experience of cost competitive wafer fabrication of foundries in Taiwan.

About this research paper

What this paper is about

System-In-Package (SIP) is a cost-effective alternative to System-On-Chip (SOC) and chips with embedded memory, The key elements of SIP technology include I/O redistribution, solder bumping, flip chip assembly, and high density thin film interconnect substrate with/without integrated passives. To meet the need of SIP, as well as other advanced packaging solutions, APack Technologies has been set up to serve worldwide customers. The high quality of the APack service is built upon SIP technology licensed from Bell Labs of Lucent Technologies, and the experience of cost competitive wafer fabrication of foundries in Taiwan.

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Available abstract

System-In-Package (SIP) is a cost-effective alternative to System-On-Chip (SOC) and chips with embedded memory, The key elements of SIP technology include I/O redistribution, solder bumping, flip chip assembly, and high density thin film interconnect substrate with/without integrated passives. To meet the need of SIP, as well as other advanced packaging solutions, APack Technologies has been set up to serve worldwide customers. The high quality of the APack service is built upon SIP technology licensed from Bell Labs of Lucent Technologies, and the experience of cost competitive wafer fabrication of foundries in Taiwan.

Key concepts: Bumping, System in package, Flip chip, Integrated circuit packaging, Chip-scale package, Embedded system, Interconnection, Chip

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