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2016•Unpublished venueRequires access

3D SiP with embedded chip providing integration solutions for power applications

Lee J. Smith

Open publisher page 3 citations

Abstract

MCP and SiP applications are expanding rapidly, enabled by advances in wafer level and substrate interconnect processes. 3D SiP with embedded chip technology can provide package architecture, integration and benefits for a diverse range of applications or performance attributes required. Power management and wireless applications have been delivering 3D SiP with embedded chip solutions for nearly a decade. New 3D SiP solutions are emerging offered by a broader range of IC suppliers to leverage both performance and cost benefits. UTAC's collaboration with AT&S offers the market a full turnkey supply chain solution addressing design for cost / performance requirements to enable customers to bring 3D SiP with embedded chip products to market more efficiently.

About this research paper

What this paper is about

MCP and SiP applications are expanding rapidly, enabled by advances in wafer level and substrate interconnect processes. 3D SiP with embedded chip technology can provide package architecture, integration and benefits for a diverse range of applications or performance attributes required. Power management and wireless applications have been delivering 3D SiP with embedded chip solutions for nearly a decade. New 3D SiP solutions are emerging offered by a broader range of IC suppliers to leverage both performance and cost benefits. UTAC's collaboration with AT&S offers the market a full turnkey supply chain solution addressing design for cost / performance requirements to enable customers to bring 3D SiP with embedded chip products to market more efficiently.

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OpenAlex reports 3 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

MCP and SiP applications are expanding rapidly, enabled by advances in wafer level and substrate interconnect processes. 3D SiP with embedded chip technology can provide package architecture, integration and benefits for a diverse range of applications or performance attributes required. Power management and wireless applications have been delivering 3D SiP with embedded chip solutions for nearly a decade. New 3D SiP solutions are emerging offered by a broader range of IC suppliers to leverage both performance and cost benefits. UTAC's collaboration with AT&S offers the market a full turnkey supply chain solution addressing design for cost / performance requirements to enable customers to bring 3D SiP with embedded chip products to market more efficiently.

Key concepts: System in package, Embedded system, System on a chip, Leverage (statistics), Computer science, Three-dimensional integrated circuit, Chip, Interconnection

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