Development of the Integration Technologies of Microsystems Based on RF Application
Yichen Fan, Yongfang Hu, Kai Cui
Abstract
Yichen Fan, Yongfang Hu, Kai Cui
Abstract
In the future, electronic system is developing towards higher integration density, higher performance and higher working frequency. Traditional integration and packaging technology will not reach the integration requirement of the novel RF microsystems. The integration technology of RF microsystems is the main method of realizing the requirement of the future electronic system. In this paper, the technology connotation and system of the RF microsystems integration technology is reviewed. The technology challenge and development opportunity is predicted. The strategic thinking of the research on the integration technology of RF microsystems is illustrated.
A significance statement is not available in the OpenAlex record.
A contribution statement is not available in the OpenAlex record.
Method details are not available in the OpenAlex metadata.
Findings are not separately available in the OpenAlex metadata.
Limitations are not available in the OpenAlex metadata.
Application details are not available in the OpenAlex metadata.
In the future, electronic system is developing towards higher integration density, higher performance and higher working frequency. Traditional integration and packaging technology will not reach the integration requirement of the novel RF microsystems. The integration technology of RF microsystems is the main method of realizing the requirement of the future electronic system. In this paper, the technology connotation and system of the RF microsystems integration technology is reviewed. The technology challenge and development opportunity is predicted. The strategic thinking of the research on the integration technology of RF microsystems is illustrated.
Key concepts: Microsystem, System integration, Radio frequency, Connotation, Systems engineering, Engineering, Technology development, Computer science