Novel Abrasion-Free CMP Technology with High Performance Polishing Slurry

At present, there are many scholars who have abrasive-free chemical mechanical polishing (AFP) research, because it effectively reduces micro-scratch and grinding adsorption, micro-corrosion, etc., but has not been applied to the project so far, mainly because it has not developed a polishing slurry suitable for engineering requirements. In addition, the removal mechanism of AFP technology is not clean yet. The results of this research, the copper achieve high-performance with a novel abrasive-free polishing solution, and the mechanism is discussed.