1998•Journal of The Surface Finishing Society of JapanOpen access

Laser-Enhanced Electroless Gold Plating on Polyimide Resin Film.

Satoshi NAGAMINE, Koichi Kobayakawa, Yuichi Sato

Abstract

Laser-enhanced electroless gold plating on polyimide resin plate was conducted in a cyanide-free bath. Electroless gold plating on polyimide resin was possible when a breakage protector such as a ceramic or copper plate was set behind the resin plate. The protector acts as a heat scatterer. Using a copper protector with higher heat conductivity produced a better gold deposit than using the ceramic plate.

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Key concepts: Polyimide, Gold plating (software engineering), Materials science, Electroless plating, Plating (geology), Breakage, Copper plating, Copper