2020•Materials Today ProceedingsRequires access

Thermal management in TSV based 3D IC Integration: A survey

Venkata Kiran Sanipini, Banothu Rakesh, Aruna Jyothi Chamanthula, N. Santoshi, A. Arunkumar Gudivada, Asisa Kumar Panigrahy

Open publisher page 39 citations

Abstract

This record does not include an abstract. Use the full-text link above if available.

About this research paper

What this paper is about

An abstract is not available in the OpenAlex record for this paper.

Why it matters

OpenAlex reports 39 citations for this work. Citation counts describe recorded attention and do not establish research quality.

Key contribution

A contribution statement is not available in the OpenAlex record.

Method / approach

Method details are not available in the OpenAlex metadata.

Main findings

Findings are not separately available in the OpenAlex metadata.

Limitations

Limitations are not available in the OpenAlex metadata.

Applications

Application details are not available in the OpenAlex metadata.

Key concepts: Three-dimensional integrated circuit, Stacking, Through-silicon via, Integrated circuit, Materials science, Thermal, Thermal management of electronic devices and systems, CMOS

Back to paper search Browse research topics Original source

Thermal management in TSV based 3D IC Integration: A survey — Research Paper | ScholarLens