Modeling of Mutual Inductance Between Superconducting Pancake Coils Used in Wireless Power Transfer (WPT) Systems
Zhanghai Shi, Xiaoyuan Chen, Zhong Cai Qiu
Abstract
Zhanghai Shi, Xiaoyuan Chen, Zhong Cai Qiu
Abstract
High temperature superconducting (HTS) technology is a good choice for developing high-power high-efficiency wireless power transfer (WPT) device because the HTS coils have very high critical current and nearly zero resistive loss. This paper investigates the modeling of self-inductance and mutual inductance between the primary and secondary ReCBO pancake coils used in HTS WPT systems. Half-analytical and half-numerical methods are adopted and verified by both the FEM simulations and practical experiments. The developed models and calculating method of mutual inductance lay some technical bases for forming a feasible designing scheme in practical HTS WPT systems.
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High temperature superconducting (HTS) technology is a good choice for developing high-power high-efficiency wireless power transfer (WPT) device because the HTS coils have very high critical current and nearly zero resistive loss. This paper investigates the modeling of self-inductance and mutual inductance between the primary and secondary ReCBO pancake coils used in HTS WPT systems. Half-analytical and half-numerical methods are adopted and verified by both the FEM simulations and practical experiments. The developed models and calculating method of mutual inductance lay some technical bases for forming a feasible designing scheme in practical HTS WPT systems.
Key concepts: Wireless power transfer, Inductance, Resistive touchscreen, Kinetic inductance, Superconducting Coils, Power (physics), Finite element method, Materials science