2006•TechConnect BriefsRequires access

Comparison between Nanoindentation and Scratch Test Hardness (Scratch Hardness) Values of Copper Thin Films on Oxidised Silicon Substrates

D. Beegan, S. Chowdhury, M. T. Laugier

Abstract

In this paper we measured for the first time the scratch hardness of copper thin films and compared this with hardness measured from nanoindentation. Copper films with thicknesses in the range 100 nm to 500 nm were deposited by rf magnetron sputtering on silicon substrates. Scratch hardness was determined by CSM™ scratch tester using scratch widths at low loads. The measured hardness values were compared with conventional nanoindentation hardness measurement by CSM™ nanohardness tester. At these low indentation depths there is a good correlation between the scratch hardness and the nanoindentation hardness, with an increase in hardness as the film thickness decreases.

About this research paper

What this paper is about

Why it matters

A significance statement is not available in the OpenAlex record.

Key contribution

A contribution statement is not available in the OpenAlex record.

Method / approach

Method details are not available in the OpenAlex metadata.

Main findings

Findings are not separately available in the OpenAlex metadata.

Limitations

Limitations are not available in the OpenAlex metadata.

Applications

Application details are not available in the OpenAlex metadata.

Available abstract

Key concepts: Nanoindentation, Scratch, Materials science, Indentation, Knoop hardness test, Indentation hardness, Copper, Silicon