Influence of pH Solution on Electroless Copper Plating Using Sodium Hypophosphite as Reducing Agent

The effect of pH solution on the electroless deposition of copper-rich Cu–Ni–P alloys, using hypophosphite as reducing agent, has been carried out. The deposition rate increased obviously with the increase of pH. The surfaces morphology, the roughness and the cristallinity depend many of pH. The kinetics of copper electroless was investigated by means of cyclic voltammetry and electrochemical impedance spectroscopy. The shape of voltammogramms and impedance diagram depend also of the pH solution.