1961•Journal of The Surface Finishing Society of JapanOpen access

On Reducing Agents in Electroless Nickel Plating Solution

Satoru Ishibashi, Hiroharu YOKOYAMA, Yasutoshi NAGASE

Abstract

Only sodium hypophosphite is now practically used as reducing agent, one of the components of electroless nickel plating solution.Some reducing agents selected from the consideration of chemical equilibrium in nickel reducing reaction were tested for the electroless nickel plating solutions.As a result, formic acid was found to be promising other than sodium hypophosphite.

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Key concepts: Sodium hypophosphite, Hypophosphite, Reducing agent, Nickel, Formic acid, Plating (geology), Electroless nickel plating, Chemistry