2018•Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and PhenomenaOpen access

Effects of oxygen-inserted layers and oxide capping layer on dopant activation for the formation of ultrashallow p-n junctions in silicon

Xi Zhang, Daniel Connelly, Hideki Takeuchi, Marek Hytha, Robert J. Mears, L. Rubin, Tsu‐Jae King Liu

Open full text 4 citations

Abstract

The effects of oxygen-inserted (OI) layers and a low-temperature-deposited oxide (LTO) capping layer on rapid thermal activation of ultrashallow implanted boron, phosphorus, and arsenic atoms in silicon (Si) are investigated using sheet resistance (Rsh) measurements, secondary ion mass spectrometry analyses, and technology computer-aided design simulations. The experimental findings suggest that the electrical activation of dopants in Si is not significantly affected by the presence of OI layers so that they can be effective for achieving lower Rsh along with shallower junction depth, thanks to reduced dopant loss and diffusion during thermal annealing. On the other hand, an LTO capping layer is found to result in larger Rsh associated with the lower peak active dopant concentration as a result of dopant segregation and/or reduced uphill diffusion. The presence of OI layers is found to mitigate these detrimental effects.

About this research paper

What this paper is about

The effects of oxygen-inserted (OI) layers and a low-temperature-deposited oxide (LTO) capping layer on rapid thermal activation of ultrashallow implanted boron, phosphorus, and arsenic atoms in silicon (Si) are investigated using sheet resistance (Rsh) measurements, secondary ion mass spectrometry analyses, and technology computer-aided design simulations. The experimental findings suggest that the electrical activation of dopants in Si is not significantly affected by the presence of OI layers so that they can be effective for achieving lower Rsh along with shallower junction depth, thanks to reduced dopant loss and diffusion during thermal annealing. On the other hand, an LTO capping layer is found to result in larger Rsh associated with the lower peak active dopant concentration as a result of dopant segregation and/or reduced uphill diffusion. The presence of OI layers is found to mitigate these detrimental effects.

Why it matters

OpenAlex reports 4 citations for this work. Citation counts describe recorded attention and do not establish research quality.

Key contribution

A contribution statement is not available in the OpenAlex record.

Method / approach

Method details are not available in the OpenAlex metadata.

Main findings

Findings are not separately available in the OpenAlex metadata.

Limitations

Limitations are not available in the OpenAlex metadata.

Applications

Application details are not available in the OpenAlex metadata.

Available abstract

The effects of oxygen-inserted (OI) layers and a low-temperature-deposited oxide (LTO) capping layer on rapid thermal activation of ultrashallow implanted boron, phosphorus, and arsenic atoms in silicon (Si) are investigated using sheet resistance (Rsh) measurements, secondary ion mass spectrometry analyses, and technology computer-aided design simulations. The experimental findings suggest that the electrical activation of dopants in Si is not significantly affected by the presence of OI layers so that they can be effective for achieving lower Rsh along with shallower junction depth, thanks to reduced dopant loss and diffusion during thermal annealing. On the other hand, an LTO capping layer is found to result in larger Rsh associated with the lower peak active dopant concentration as a result of dopant segregation and/or reduced uphill diffusion. The presence of OI layers is found to mitigate these detrimental effects.

Key concepts: Dopant, Dopant Activation, Boron, Silicon, Annealing (glass), Materials science, Secondary ion mass spectrometry, Sheet resistance

Related papers

Back to paper searchBrowse research topicsOriginal source
Effects of oxygen-inserted layers and oxide capping layer on dopant activation for the formation of ultrashallow p-n junctions in silicon — Research Paper | ScholarLens