2011•Journal of Materials Science Materials in ElectronicsRequires access

Suppression of interfacial intermetallic compounds between Sn–9Zn solder and Cu-substrate by adding Cu-particles in the solder

G. Q. Wei, Yingzhuo Huang

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Key concepts: Intermetallic, Soldering, Materials science, Substrate (aquarium), Metallurgy, Copper, Alloy, Oceanography

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Suppression of interfacial intermetallic compounds between Sn–9Zn solder and Cu-substrate by adding Cu-particles in the solder — Research Paper | ScholarLens