2018•The International Journal of Advanced Manufacturing TechnologyRequires access

The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly

Fakhrozi Che Ani, Azman Jalar, Abdullah Aziz Saad, C. Y. Khor, R. Ismail, Zuraihana Bachok, Aizat Abas, Norinsan Kamil Othman

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Key concepts: Soldering, Materials science, Reflow soldering, Fillet (mechanics), Nanoindentation, Solder paste, Microstructure, Energy-dispersive X-ray spectroscopy

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