2014•Unpublished venueRequires access

Reactive paste for reflow soldering of large components

Dirk Seehase, Heiko Huth, Arne Neiser, Mathias Nowottnick

Abstract

For the energetic support of reflow soldering an exothermic reacting paste has been developed. This paste is applied on electronic assemblies adjacent to solder paste deposits before reflow soldering. During the reflow process a chemical reaction inside the paste is releasing energy in the form of heat. This heat is assisting in melting up the solder paste depots, hence allowing the processing of large components at lower peak temperatures. Such created solder joints are analyzed here towards their reliability. Also two examples of employing the reacting paste to aid in the soldering process of large components are given.

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Key concepts: Soldering, Solder paste, Reflow soldering, Exothermic reaction, Materials science, Dip soldering, Metallurgy, Process (computing)