2017•Microelectronics ReliabilityRequires access

Fatigue life prediction of Package-on-Package stacking assembly under random vibration loading

Jiang Xia, Guoyuan Li, Bin Li, Lanxian Cheng, Bin Zhou

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Key concepts: Vibration fatigue, Random vibration, Structural engineering, Vibration, Soldering, Finite element method, Stress (linguistics), Engineering