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2017•Springer series in advanced microelectronicsRequires access

Direct Cu to Cu Bonding and Other Alternative Bonding Techniques in 3D Packaging

Tadatomo Suga, Ran He, George Vakanas, Antonio Manna

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Key concepts: Thermocompression bonding, Anodic bonding, Direct bonding, Materials science, Passivation, Soldering, Diffusion bonding, Stacking

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