Scan chain swapping using TSVs for test power reduction in 3D-IC

Although the hot issue of chip design becomes 3-dimensional IC, design for testability is still mandatory part of chip design. Scan structure is widely used for system reliability. However, power consumption and heat problems are necessarily considered when design is under test. In this paper, scan chain swapping method using TSVs is presented to reduce shift power in scan in operation. Proper X-filling and swapping algorithm can improve proposed scan chain swapping method. The experiment result demonstrates the power reduction in test mode.