2011•Unpublished venueRequires access

The Most Cost-Effective Integrator (TSV Interposer) for 3D IC Integration System-in-Package (SiP)

John H. Lau

Abstract

The significant roles of Cu-filled TSV passive interposers for 3D IC integration are investigated in this study. Emphasis is placed on the roles they play as: (1) substrates; (2) carriers; (3) thermal management tools; and (4) reliability buffers. It is shown that the Cu-filled TSV passive interposers are the most cost-effective integrator for 3D IC integration system-in-package (SiP).

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Key concepts: Interposer, System in package, Three-dimensional integrated circuit, Integrator, Reliability (semiconductor), Integrated circuit, Materials science, Integrated circuit packaging