The development of thermally stable adhesives for titanium alloy and boron composite structures

Abstract : This final report describes the work performed to develop thermally stable adhesives for bonding titanium alloy and boron composite substrates. TRW A-type polyimide technology was employed as a basis for a series of adhesive formulations evaluated for bonding titanium alloy 6A14V and boron/polyimide composites. It was shown that copolymeric blends of an A-type polyimide and amide-imide resin provided superior adhesive properties at elevated and cryogenic temperatures than state-of-the-art adhesives. Data are presented for the most promising adhesive selected during this program on long term elevated and cryogenic aging of bonded assemblies and for stress-rupture tests at elevated temperature. jg p2