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2003•Unpublished venueRequires access

Application and Development of Surface Mount Technology

GU Ai-yun

Open publisher page 2 citations

Abstract

It is in the special stage to transfer from lead solder to lead-free solder. The things such as lead-free material、PCB、component、examination and reliability have no common standard. In this paper, the actuality of lead-free solder and its characteristics and countermeasures are introduced in detail, otherwise, the main problems of lead-free solder and the problems when lead solder and lead-free solder were used together that should be paid attention to during the transfer stage are also analyzed entirely.

About this research paper

What this paper is about

It is in the special stage to transfer from lead solder to lead-free solder. The things such as lead-free material、PCB、component、examination and reliability have no common standard. In this paper, the actuality of lead-free solder and its characteristics and countermeasures are introduced in detail, otherwise, the main problems of lead-free solder and the problems when lead solder and lead-free solder were used together that should be paid attention to during the transfer stage are also analyzed entirely.

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OpenAlex reports 2 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

It is in the special stage to transfer from lead solder to lead-free solder. The things such as lead-free material、PCB、component、examination and reliability have no common standard. In this paper, the actuality of lead-free solder and its characteristics and countermeasures are introduced in detail, otherwise, the main problems of lead-free solder and the problems when lead solder and lead-free solder were used together that should be paid attention to during the transfer stage are also analyzed entirely.

Key concepts: Soldering, Lead (geology), Surface-mount technology, Reliability (semiconductor), Mount, Solder paste, Wave soldering, Forensic engineering

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Application and Development of Surface Mount Technology — Research Paper | ScholarLens