2004Electronic Components and MaterialsRequires access

The Trend Towards Lead-free in Electronic Packages and Its Choke Point

Tian Min-bo

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Abstract

The European Union has passed two prescripts to restrict the use of lead and orther injurant in electronic products. The products containing lead will be eliminated in market soon. Lead-free solder is the key to electronic assembly engineering (lead-free package). Now the research on lead-free solder focuses on two fields: Sn base solder and conductive adhesive. The disadvantages of three typical lead-free solders, and three problems in the conductive adhesive study are discussed. So far, there is no international standard about the use of lead-free solder.

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What this paper is about

The European Union has passed two prescripts to restrict the use of lead and orther injurant in electronic products. The products containing lead will be eliminated in market soon. Lead-free solder is the key to electronic assembly engineering (lead-free package). Now the research on lead-free solder focuses on two fields: Sn base solder and conductive adhesive. The disadvantages of three typical lead-free solders, and three problems in the conductive adhesive study are discussed. So far, there is no international standard about the use of lead-free solder.

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Available abstract

The European Union has passed two prescripts to restrict the use of lead and orther injurant in electronic products. The products containing lead will be eliminated in market soon. Lead-free solder is the key to electronic assembly engineering (lead-free package). Now the research on lead-free solder focuses on two fields: Sn base solder and conductive adhesive. The disadvantages of three typical lead-free solders, and three problems in the conductive adhesive study are discussed. So far, there is no international standard about the use of lead-free solder.

Key concepts: Lead (geology), Soldering, Materials science, Electrical conductor, Electronic packaging, Adhesive, Electronic equipment, Electronics

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