Fabrication and Testing of the MEMS High Temperature Capacitive Pressure Micro-sensor

MEMS high temperature capacitive pressure micro-sensor that combines a touch-modestructure and the silicon-silicon fusion bonding technique are mainly introduced. The producingtechnology is given in details. The testing equipment and testing circuit are introduced and ana-lyzed in details. At last, some testing experiments are done for the produced high temperature ca-pacitive pressure micro-sensors. The results proved that this type of micro-sensor can work wellunder 350℃, and has excellent linearity, relatively good stability and relatively high sensitivity; ithas lots of application fields.