2007Trace Elements ScienceRequires access

Determination of Micro Chloride Ion in Acidic Copper Electroplating Solution by Turbidimetric

HU Xiaobao

Open publisher page 2 citations

Abstract

Microamounts of chloride ion in acidic copper electroplating solution was determined directly by the silver chloride turbidimetric method in the presence of the major component Cu2+ ion with glycol as solubilizing agent and silver nitrate as precipitating agent.The determination wave length is 440 nm,the linear range is 0~50 μg/25 mL,the apparent molar absorptivity is e=1.3×105,and the limit of detection is 0.035 μg/mL.The recovery of chloride ion in different levels was measured in acidic copper electroplating solution,the result is 95.4%~104.5%.Moreover,no interference was found in the presence of other familiar coexisting ion.The method is rapid,accurate and simple.

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Microamounts of chloride ion in acidic copper electroplating solution was determined directly by the silver chloride turbidimetric method in the presence of the major component Cu2+ ion with glycol as solubilizing agent and silver nitrate as precipitating agent.The determination wave length is 440 nm,the linear range is 0~50 μg/25 mL,the apparent molar absorptivity is e=1.3×105,and the limit of detection is 0.035 μg/mL.The recovery of chloride ion in different levels was measured in acidic copper electroplating solution,the result is 95.4%~104.5%.Moreover,no interference was found in the presence of other familiar coexisting ion.The method is rapid,accurate and simple.

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Available abstract

Microamounts of chloride ion in acidic copper electroplating solution was determined directly by the silver chloride turbidimetric method in the presence of the major component Cu2+ ion with glycol as solubilizing agent and silver nitrate as precipitating agent.The determination wave length is 440 nm,the linear range is 0~50 μg/25 mL,the apparent molar absorptivity is e=1.3×105,and the limit of detection is 0.035 μg/mL.The recovery of chloride ion in different levels was measured in acidic copper electroplating solution,the result is 95.4%~104.5%.Moreover,no interference was found in the presence of other familiar coexisting ion.The method is rapid,accurate and simple.

Key concepts: Chloride, Electroplating, Chemistry, Copper, Silver nitrate, Molar absorptivity, Inorganic chemistry, Ion

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