1973•Unpublished venueRequires access

New laminates for printed circuit boards

Kohtaro Yanagihara, Soji Sugie, Morio Gaku

Abstract

The rapid progress in reliability and performance of electronic equipment in recent years calls for further improvement in circuit density, reliability and electrical properties of printed circuit boards on which IC or LSI is installed. This problem can be solved only by new development in such as board material, plating, and manufacturing process and technologies.

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Available abstract

Key concepts: Printed circuit board, Reliability (semiconductor), Circuit reliability, Process (computing), Plating (geology), Engineering, Computer science, Electrical engineering