Reliability investigations of printed circuit boards
Sylvia Ehrler
Abstract
Sylvia Ehrler
Abstract
Summary form only given. Reliability is one of the key performance measures of current printed circuit boards. This paper deals with the reliability of various PCB base materials. The influence of plated Cu-thickness, surface finish metallization and aspect ratio and the possible difference between connections on the outer and inner layers of a board are considered.
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Summary form only given. Reliability is one of the key performance measures of current printed circuit boards. This paper deals with the reliability of various PCB base materials. The influence of plated Cu-thickness, surface finish metallization and aspect ratio and the possible difference between connections on the outer and inner layers of a board are considered.
Key concepts: Printed circuit board, Reliability (semiconductor), Circuit reliability, Materials science, Base (topology), Reliability engineering, Computer science, Mechanical engineering