2002•Unpublished venueRequires access

Reliability investigations of printed circuit boards

Sylvia Ehrler

Open publisher page 2 citations

Abstract

Summary form only given. Reliability is one of the key performance measures of current printed circuit boards. This paper deals with the reliability of various PCB base materials. The influence of plated Cu-thickness, surface finish metallization and aspect ratio and the possible difference between connections on the outer and inner layers of a board are considered.

About this research paper

What this paper is about

Summary form only given. Reliability is one of the key performance measures of current printed circuit boards. This paper deals with the reliability of various PCB base materials. The influence of plated Cu-thickness, surface finish metallization and aspect ratio and the possible difference between connections on the outer and inner layers of a board are considered.

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OpenAlex reports 2 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

Summary form only given. Reliability is one of the key performance measures of current printed circuit boards. This paper deals with the reliability of various PCB base materials. The influence of plated Cu-thickness, surface finish metallization and aspect ratio and the possible difference between connections on the outer and inner layers of a board are considered.

Key concepts: Printed circuit board, Reliability (semiconductor), Circuit reliability, Materials science, Base (topology), Reliability engineering, Computer science, Mechanical engineering

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