2011•Applied Chemical IndustryRequires access
Study of the electroless copper plating processes using sodium hypophosphite
Zhu Rong-xia
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Abstract
Sodium hypophosphite is used as the reductant of the electroless copper deposition instead of traditional reductant-formaldehyde and the electroless copper plating processes is studied.It revealed the influence of the dosage of chelator(potassium-sodium tartrate) and sodium hypophosphite on the rate of copper deposition.The best technology condition is that the concentration of potassium-sodium tartrate is 15 g/L,sodium hypophosphite is 30 g/L,and the pH is 11,the temperature is 65 ℃.