2011•Journal of Inner Mongolia Agricultural UniversityRequires access
RESEARCH ON STABILITY OF COPPER PLATING SOLUTION TREATED BY DIFFERRENT REDUCING AGENT ON WOOD
Wang Pen
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Abstract
In order to get ideal technology of wood chemical copper plating,sodium hypophosphite and formaldehyde as reducing agents,the paper research the stability of copper plating solution treated on wood.By comparison,we found that different reducing agents have different effects ways on the stability.Reducing agent and the concentration ratio of major salt also affect the stability of plating solution,so the reasonable ratio is conducive to the stability.Meanwhile,the reducing agent and the concentration ratio of complexing agent are also important factors in the stability of plating solution.By comparing the decomposition time of palladium chloride added into two different reducing agents,we found that used sodium hypophosphite as reducing agent,the stability of plating solution is much higher than formaldehyde.