Advances in the Change of Main Compositions of Electroless Copper Plating using Sodium Hypophosphite as Reducing Agent

With the attention of environmental protection,electroless copper plating using formaldehyde as reducing agent will be replaced by the environment-friendly plating bath.Electroless copper plating using sodium hypophosphite as reducing agent has the advantages of wide operation range,long-life of the electrolyte and harmless to the environment,and it might be the the research focus.The advances in the change of the main composition of the bath were overviewed.The direction of future development of the sodium hypophosphite plating bath was illustrated.