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Study on curing kinetics of a novel epoxy resin adhesive

Chen Hong-jiang

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Abstract

The curing process of a novel modified epoxy resin adhesive systems was in detail studied by non-isothermal differential scanning calorimeter(DSC)technique,and kinetics of the curing process was analyzed by Kissinger,Crane and Arrhenius equations.The results showed that the apparent activation energy of the curing reaction is 59.18 kJ/mol,and the reaction order is 0.89.With the dynamical DSC spectrum of the epoxy resin adhesive,the curing process of the epoxy resin adhesive systems was determined as 130 ℃/1 h+150 ℃/2 h+175 ℃/3 h.

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What this paper is about

The curing process of a novel modified epoxy resin adhesive systems was in detail studied by non-isothermal differential scanning calorimeter(DSC)technique,and kinetics of the curing process was analyzed by Kissinger,Crane and Arrhenius equations.The results showed that the apparent activation energy of the curing reaction is 59.18 kJ/mol,and the reaction order is 0.89.With the dynamical DSC spectrum of the epoxy resin adhesive,the curing process of the epoxy resin adhesive systems was determined as 130 ℃/1 h+150 ℃/2 h+175 ℃/3 h.

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Available abstract

The curing process of a novel modified epoxy resin adhesive systems was in detail studied by non-isothermal differential scanning calorimeter(DSC)technique,and kinetics of the curing process was analyzed by Kissinger,Crane and Arrhenius equations.The results showed that the apparent activation energy of the curing reaction is 59.18 kJ/mol,and the reaction order is 0.89.With the dynamical DSC spectrum of the epoxy resin adhesive,the curing process of the epoxy resin adhesive systems was determined as 130 ℃/1 h+150 ℃/2 h+175 ℃/3 h.

Key concepts: Epoxy, Materials science, Adhesive, Curing (chemistry), Differential scanning calorimetry, Activation energy, Composite material, Isothermal process

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