2002Chemistry and AdhesionRequires access

Modified epoxy Structural adhesive fast curing at 70

Weijun Zhang

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Abstract

In this paper,a kind of modified epoxy Structural adhesive fast curing at 70℃/45 min is introduced.The adhesive has good property of peel and shear strength at 25-80℃.And the adhesive has long pot life at room temperature It has been used in automobile industry.

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What this paper is about

In this paper,a kind of modified epoxy Structural adhesive fast curing at 70℃/45 min is introduced.The adhesive has good property of peel and shear strength at 25-80℃.And the adhesive has long pot life at room temperature It has been used in automobile industry.

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Available abstract

In this paper,a kind of modified epoxy Structural adhesive fast curing at 70℃/45 min is introduced.The adhesive has good property of peel and shear strength at 25-80℃.And the adhesive has long pot life at room temperature It has been used in automobile industry.

Key concepts: Adhesive, Epoxy adhesive, Epoxy, Materials science, Curing (chemistry), Composite material, Layer (electronics)

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