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Study of High Property Epoxy Adhesive with Fast Curing at Room Temperature

Qi-Feng Jing

Abstract

In order to improve the curing speed and mechanical property,the effect of curing and filler agent content on the mechanical property of the epoxy adhesive is investigated in this paper.The results show that when the curing agent content is in the range of 95-100phr and the filler agent content is in the range of 60-80phr,the epoxy adhesive exhibits excellent synthetic property.This new epoxy adhesive can be rapidly cured at the room temperature within 12 minutes.The values of its maximum shear strength,tensile strength and bending strength of the new epoxy adhesive are 13.8MPa,43.1MPa and 83.2MPa respectively.

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Key concepts: Epoxy, Adhesive, Materials science, Curing (chemistry), Composite material, Ultimate tensile strength, Epoxy adhesive, Layer (electronics)