2007Journal of North China Institute of Aerospace EngineeringRequires access

Optimizing of Parameters about Stencil Printing

HE Shi-xian

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Abstract

Stencil printing is the first working procedure in surface mount processes and it is the most important part of all the operations . About 60%-70% jointing objections in surface mount processes relate to it. In this article, the problems involved in the process of stencil printing are refered to. And it mainly introduces parameters of solder paste and printing machines(especially the parameters related to scraper). Futhermore, this article introduces how to select proper values in these parameters to get the best printing effects in practice.

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What this paper is about

Stencil printing is the first working procedure in surface mount processes and it is the most important part of all the operations . About 60%-70% jointing objections in surface mount processes relate to it. In this article, the problems involved in the process of stencil printing are refered to. And it mainly introduces parameters of solder paste and printing machines(especially the parameters related to scraper). Futhermore, this article introduces how to select proper values in these parameters to get the best printing effects in practice.

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Available abstract

Stencil printing is the first working procedure in surface mount processes and it is the most important part of all the operations . About 60%-70% jointing objections in surface mount processes relate to it. In this article, the problems involved in the process of stencil printing are refered to. And it mainly introduces parameters of solder paste and printing machines(especially the parameters related to scraper). Futhermore, this article introduces how to select proper values in these parameters to get the best printing effects in practice.

Key concepts: Stencil, Surface-mount technology, Solder paste, Process (computing), Mount, Computer science, Mechanical engineering, Engineering drawing

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