Influence of temperature on diffusion bonding of Cu/Al joints

Copper and aluminum were bonded by vacuum diffusion bonding technology,and effects of temperature on microstructure and tensile properties were studied.The microstructures of joints were investigated using scanning electron microscopy(SEM).The experiment results show that Cu/Al can be bonded by vacuum diffusion bonding technology.The tensile strength of the joints increases with temperature increasing,and when the bonding temperature is 540 ℃,its tensile strength can reach 185 MPa.Fracture surface shows a typical brittle fracture.