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Effects of Holding Time on Vacuum Diffusion Bonding of Al/Cu

Li Bai

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Abstract

Aluminum alloy and Copper(T2) were bonded by vacuum diffusion bonding,and the effects of holding time on the microstructure and mechanical properties of welded joint were studied.The element diffusion behavior and microstructure of the welded joint were studied by SEM and EDS.The results show that the tensile strength of the welded joints increases as increasing the diffusion time,and the tensile strength of the welded joint can reach 185 MPa.

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What this paper is about

Aluminum alloy and Copper(T2) were bonded by vacuum diffusion bonding,and the effects of holding time on the microstructure and mechanical properties of welded joint were studied.The element diffusion behavior and microstructure of the welded joint were studied by SEM and EDS.The results show that the tensile strength of the welded joints increases as increasing the diffusion time,and the tensile strength of the welded joint can reach 185 MPa.

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Available abstract

Aluminum alloy and Copper(T2) were bonded by vacuum diffusion bonding,and the effects of holding time on the microstructure and mechanical properties of welded joint were studied.The element diffusion behavior and microstructure of the welded joint were studied by SEM and EDS.The results show that the tensile strength of the welded joints increases as increasing the diffusion time,and the tensile strength of the welded joint can reach 185 MPa.

Key concepts: Microstructure, Materials science, Welding, Joint (building), Ultimate tensile strength, Diffusion, Diffusion bonding, Alloy

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