Joining mechanism of field-assisted diffusion bonding of solid electrolyte ceramic to metals
Meng Qing
Abstract
Meng Qing
Abstract
Field assisted diffusion bonding applied in the joining of solid electrolyte borosilicate glass, β ″ Al 2O 3, Y 2O ZrO 2 to monocrystal silicate and aluminum were proceeded with bonding machine in the assistance of static electric field. TEM, SEM, XRD and other means were applied to investigate and analyze microstructure of interface. It is supposed that the interfacial area is a model of metal oxides ceramic, and the joining mechanism is solid diffusion joining and static electric bonding. The process of ions migration and accumulation under electric field is the most essential factor for the anodic oxidation and interfacial joining. Temperature and voltage are the basic factors of the solid diffusion bonding of interfacial oxidation. And voltage, temperature, pressure and the condition of surface are the most important factors that govern the bonding process.
A significance statement is not available in the OpenAlex record.
A contribution statement is not available in the OpenAlex record.
Method details are not available in the OpenAlex metadata.
Findings are not separately available in the OpenAlex metadata.
Limitations are not available in the OpenAlex metadata.
Application details are not available in the OpenAlex metadata.
Field assisted diffusion bonding applied in the joining of solid electrolyte borosilicate glass, β ″ Al 2O 3, Y 2O ZrO 2 to monocrystal silicate and aluminum were proceeded with bonding machine in the assistance of static electric field. TEM, SEM, XRD and other means were applied to investigate and analyze microstructure of interface. It is supposed that the interfacial area is a model of metal oxides ceramic, and the joining mechanism is solid diffusion joining and static electric bonding. The process of ions migration and accumulation under electric field is the most essential factor for the anodic oxidation and interfacial joining. Temperature and voltage are the basic factors of the solid diffusion bonding of interfacial oxidation. And voltage, temperature, pressure and the condition of surface are the most important factors that govern the bonding process.
Key concepts: Anodic bonding, Materials science, Diffusion bonding, Borosilicate glass, Ceramic, Electrolyte, Thermocompression bonding, Diffusion