Deng Yong-he
Abstract
The structure and realization of the new dual-E silicon chip is introduced. Dual-E chips and acceleration sensors with different scales can be produced by controlling the thickness of different sensitive films.
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The structure and realization of the new dual-E silicon chip is introduced. Dual-E chips and acceleration sensors with different scales can be produced by controlling the thickness of different sensitive films.
Key concepts: Silicon chip, Acceleration, Chip, Realization (probability), Silicon, Dual (grammatical number), Materials science, Electronic engineering