2007Journal of Optoelectronics·laserRequires access

Texturing of Multicrystalline Silicon Wafers for Solar Cells with Acidic Etching Solutions

Qiuyan Hao

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Abstract

Multicrystalline silicon(mc-Si)wafers were isotropically textured using acid texturing methods.The acid etching solution was an aqueous solution of nitric acid(HNO3)and hydrofluoric acid(HF)for the investigation of the wet chemical approach,and it was modified with H3PO4.The mc-Si surface morphology and reflectance were analyzed by scanning electron microscope(SEM)and spectrum response system respectively.Results showed that the surface etched by the acid solution was distributed with uniform earthworm-like etched-pits,and it had a very low reflectance.After PECVD Si3N4 the reflectance decreased remarkably.

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What this paper is about

Multicrystalline silicon(mc-Si)wafers were isotropically textured using acid texturing methods.The acid etching solution was an aqueous solution of nitric acid(HNO3)and hydrofluoric acid(HF)for the investigation of the wet chemical approach,and it was modified with H3PO4.The mc-Si surface morphology and reflectance were analyzed by scanning electron microscope(SEM)and spectrum response system respectively.Results showed that the surface etched by the acid solution was distributed with uniform earthworm-like etched-pits,and it had a very low reflectance.After PECVD Si3N4 the reflectance decreased remarkably.

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Available abstract

Multicrystalline silicon(mc-Si)wafers were isotropically textured using acid texturing methods.The acid etching solution was an aqueous solution of nitric acid(HNO3)and hydrofluoric acid(HF)for the investigation of the wet chemical approach,and it was modified with H3PO4.The mc-Si surface morphology and reflectance were analyzed by scanning electron microscope(SEM)and spectrum response system respectively.Results showed that the surface etched by the acid solution was distributed with uniform earthworm-like etched-pits,and it had a very low reflectance.After PECVD Si3N4 the reflectance decreased remarkably.

Key concepts: Wafer, Hydrofluoric acid, Etching (microfabrication), Nitric acid, Materials science, Scanning electron microscope, Aqueous solution, Silicon

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