Study of performance of a heat resisting foamed adhesive
Nan Qi
Abstract
Nan Qi
Abstract
Thermal and mechanical properties of FP foamed adhesive were tested and analyzed. Curing property of the adhesive was studied by thermal analysis. The results showed that mechanical properties of FP foamed adhesive were related to padding density and curing temperature: increasing of the padding density can increase the tube shear strength, and increasing of curing temperature can increase the shear strength. When FP foamed adhesive is cured at moderate temperature the FP foamed adhesive can have excellent resistance to high temperature.
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Thermal and mechanical properties of FP foamed adhesive were tested and analyzed. Curing property of the adhesive was studied by thermal analysis. The results showed that mechanical properties of FP foamed adhesive were related to padding density and curing temperature: increasing of the padding density can increase the tube shear strength, and increasing of curing temperature can increase the shear strength. When FP foamed adhesive is cured at moderate temperature the FP foamed adhesive can have excellent resistance to high temperature.
Key concepts: Materials science, Adhesive, Composite material, Curing (chemistry), Padding, Layer (electronics)