ScholarLens Back to search
2007•Journal of Fujian Forestry Science and TechnologyRequires access

Study on the application of UF-G low formaldehyde emission UF resin for plywood

Yuerong Liu

Open publisher page 0 citations

Abstract

This paper studied the application of UF-G low formaldehyde emission UF resin for plywood.The result showed the optimum glue regulating parameters were flour content 25%,curing agent content 1.2%.The optimum hot pressing technology parameters were temperature 110℃,pressure 1.2 MPa,time 60 s·mm-1,and glue spread amount 300 g·m-2.Formaldehyde emission of plywood pressed by this way reached E1 grade,and bonding strength meeted the demand of national standard.

About this research paper

What this paper is about

This paper studied the application of UF-G low formaldehyde emission UF resin for plywood.The result showed the optimum glue regulating parameters were flour content 25%,curing agent content 1.2%.The optimum hot pressing technology parameters were temperature 110℃,pressure 1.2 MPa,time 60 s·mm-1,and glue spread amount 300 g·m-2.Formaldehyde emission of plywood pressed by this way reached E1 grade,and bonding strength meeted the demand of national standard.

Why it matters

A significance statement is not available in the OpenAlex record.

Key contribution

A contribution statement is not available in the OpenAlex record.

Method / approach

Method details are not available in the OpenAlex metadata.

Main findings

Findings are not separately available in the OpenAlex metadata.

Limitations

Limitations are not available in the OpenAlex metadata.

Applications

Application details are not available in the OpenAlex metadata.

Available abstract

This paper studied the application of UF-G low formaldehyde emission UF resin for plywood.The result showed the optimum glue regulating parameters were flour content 25%,curing agent content 1.2%.The optimum hot pressing technology parameters were temperature 110℃,pressure 1.2 MPa,time 60 s·mm-1,and glue spread amount 300 g·m-2.Formaldehyde emission of plywood pressed by this way reached E1 grade,and bonding strength meeted the demand of national standard.

Key concepts: Formaldehyde, GLUE, Curing (chemistry), Bonding strength, National standard, Materials science, Composite material, Pulp and paper industry

Related papers

Related paper 1Related paper 2Related paper 3
Back to paper searchBrowse research topicsOriginal source
Study on the application of UF-G low formaldehyde emission UF resin for plywood — Research Paper | ScholarLens