2006Electronics & PackagingRequires access

Ribbon Wire Bonding Technology

Guo Da-qi

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Abstract

Ribbon wire bonding is different from conventional wire bonding technology. One advantage of ribbon over round wire is that its high frequency impedance is lower which reduces both the inductance and the skin-effect losses. As such, it is often used in microwave devices. The ribbon wire bonding procedure, different wire break off modes, wire specifications and the choosing method of wedge tool are discussed in considerable detail in the article.

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What this paper is about

Ribbon wire bonding is different from conventional wire bonding technology. One advantage of ribbon over round wire is that its high frequency impedance is lower which reduces both the inductance and the skin-effect losses. As such, it is often used in microwave devices. The ribbon wire bonding procedure, different wire break off modes, wire specifications and the choosing method of wedge tool are discussed in considerable detail in the article.

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Available abstract

Ribbon wire bonding is different from conventional wire bonding technology. One advantage of ribbon over round wire is that its high frequency impedance is lower which reduces both the inductance and the skin-effect losses. As such, it is often used in microwave devices. The ribbon wire bonding procedure, different wire break off modes, wire specifications and the choosing method of wedge tool are discussed in considerable detail in the article.

Key concepts: Ribbon, Wire bonding, Wedge (geometry), Materials science, Inductance, Microwave, Optoelectronics, Electrical impedance

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