Ribbon Wire Bonding Technology
Guo Da-qi
Abstract
Guo Da-qi
Abstract
Ribbon wire bonding is different from conventional wire bonding technology. One advantage of ribbon over round wire is that its high frequency impedance is lower which reduces both the inductance and the skin-effect losses. As such, it is often used in microwave devices. The ribbon wire bonding procedure, different wire break off modes, wire specifications and the choosing method of wedge tool are discussed in considerable detail in the article.
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Ribbon wire bonding is different from conventional wire bonding technology. One advantage of ribbon over round wire is that its high frequency impedance is lower which reduces both the inductance and the skin-effect losses. As such, it is often used in microwave devices. The ribbon wire bonding procedure, different wire break off modes, wire specifications and the choosing method of wedge tool are discussed in considerable detail in the article.
Key concepts: Ribbon, Wire bonding, Wedge (geometry), Materials science, Inductance, Microwave, Optoelectronics, Electrical impedance