1973•Unpublished venueOpen access
Microelectronic interconnection bonding with ribbon wire
Holger Kessler
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Abstract
NBTNAE Cover photograph.SEM photomicrograph of bonds made with 3-by 0.5-mil aluminum (1% silicon) wire on 5-mil square aluminum pads.The capability of placing ribbon-wire bonds one on top of another is shown.Four bonds are stacked at the center of the letter "B" (Magnification 60X) For sale by the Superintendent of Documents, U.S. Government Printing Office, Washington, D.C. 20402
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