EFFECT OF COOLING RATE ON TIN PENETRATION IN THE SUBSURFACE LAYER OF FLOAT BOROSILICATE GLASS
Junpeng Wan
Abstract
Junpeng Wan
Abstract
The float process of float borosilicate glass was simulated by a minitype graphite tin bath. The glass samples were pro- duced at different cooling rates from 1 250 ℃ to 650 ℃. The tin depth profiles were studied by electron probe microanalysis. It was found that tin diffused into the borosilicate glass with a total penetration depth of 40. 0 μm. Tin ions mainly diffused into the interior of the borosilicate glass at higher temperatures (1 050 ℃) and entered the near-surface at lower temperature (1 050 ℃). The amount of tin in the near-surface is increased with the prolonging of time, but the amount of tin in the interior deeper than 7.0 μm remains invariable with time. In the whole float process, the tin depth profiles show a satellitic peak at 15. 0 μm depth, but the satel- litic peak disappeares at the lower temperature range of the tin bath.
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The float process of float borosilicate glass was simulated by a minitype graphite tin bath. The glass samples were pro- duced at different cooling rates from 1 250 ℃ to 650 ℃. The tin depth profiles were studied by electron probe microanalysis. It was found that tin diffused into the borosilicate glass with a total penetration depth of 40. 0 μm. Tin ions mainly diffused into the interior of the borosilicate glass at higher temperatures (1 050 ℃) and entered the near-surface at lower temperature (1 050 ℃). The amount of tin in the near-surface is increased with the prolonging of time, but the amount of tin in the interior deeper than 7.0 μm remains invariable with time. In the whole float process, the tin depth profiles show a satellitic peak at 15. 0 μm depth, but the satel- litic peak disappeares at the lower temperature range of the tin bath.
Key concepts: Float glass, Borosilicate glass, Tin, Materials science, Penetration (warfare), Metallurgy, Penetration depth, Graphite