Process research of magnetic anti-scaling based on electroless composite plating

A piece of electroless Ni-P-Fe3O4 composite plating is prepared on copper substrates by electroless composite plating method.The process conditions for Ni-P-Fe3O4 electroless composite plating are optimized by orthogonal test.The optimal process parameters are shown as follows: 35 g/L of NiSO4.6H2O,29 g/L of NaH2PO2.H2O,0.2 g/L of A surfactant and 20 mL of B surfactant,78℃ of temperature and 6.5 of pH value.The plating morphology is observed by using scanning electron microscopy(SEM)/the optimal mass concentration of magnetic Fe3O4 powder is 4 g/L.The results of contact angle measurements and adhesion test indicate that Ni-P-Fe3O4 plating reduces the surface free energy of copper matrix,which can reduce the deposition of the coating adhesion.The adhesion speed on Ni-P-Fe3O4 plating is reduced by 41%.