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Recent Development of Lead-Free Solder in Electronic Packaging

Tian Min-bo

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Abstract

Along with the issue of WEEE/RoHS, electronic packaging industry raised the furtherrequirement for lead-free jointing. The three substitutes of lead-free solder were brought forwardaccording to the recent research. Three main weaknesses about the lead-free solder being usednowadays were summarized, and a summarization of the advantages and disadvantages about theinternational recommended lead-free solders were made as well.

About this research paper

What this paper is about

Along with the issue of WEEE/RoHS, electronic packaging industry raised the furtherrequirement for lead-free jointing. The three substitutes of lead-free solder were brought forwardaccording to the recent research. Three main weaknesses about the lead-free solder being usednowadays were summarized, and a summarization of the advantages and disadvantages about theinternational recommended lead-free solders were made as well.

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Available abstract

Along with the issue of WEEE/RoHS, electronic packaging industry raised the furtherrequirement for lead-free jointing. The three substitutes of lead-free solder were brought forwardaccording to the recent research. Three main weaknesses about the lead-free solder being usednowadays were summarized, and a summarization of the advantages and disadvantages about theinternational recommended lead-free solders were made as well.

Key concepts: Lead (geology), Soldering, Automatic summarization, Electronic packaging, Manufacturing engineering, Materials science, Engineering, Metallurgy

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