Influence of diffusion bonding conditions on bonding strength of damping copper alloy to stainless steel

The experimental investigation of different transition metals was carried out in the diffusion bonding joints of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti). The microstructure of the joint was analyzed with microscopic examination, SEM, EPMA and X ray diffraction. Following conclusions have been drawn: (1) The joint strength with the Ni interlayer was higher than that with Cu interlayer when the welding parameters were same;(2)When Ni interlayer was thinner,Al could interact with Ni and Fe,and the intermetallic compounds,such as Fe 3Al etc,were formed in the interface,which decreased the strength of the joints;(3)When the bonding temperature was higher,because of the diffusion of Cu in Ni being faster than Ni in Cu,a Kirkendall effect was produced,which also decreased the strength of the joints.