2012•Materials & Design (1980-2015)Requires access

Microstructure and bonding strength of diffusion welding of Mo/Cu joints with Ni interlayer

Jian Zhang, Qiang Shen, Guoqiang Luo, Meijuan Li, Lianmeng Zhang

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Key concepts: Intermetallic, Diffusion bonding, Microstructure, Materials science, Diffusion, Diffusion welding, Ultimate tensile strength, Joint (building)

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Microstructure and bonding strength of diffusion welding of Mo/Cu joints with Ni interlayer — Research Paper | ScholarLens