Influence of additive concentration on coating morphology of electroplated diamond wire

Effect of additive concentration on electroplated morphology of diamond wire was studied through experiments.The baseline was a copper-coated high-carbon steel wire with its diameter of 0.115 mm.Particle size of diamond was 8—16μm,surface of which was chemically plated with nickel phosphorus alloy with a weight increase of 30%.Additive concentration ranging from 0to 400mg/L.It was showed that with the increase of additive concentration,diamond gradually stopped reunion on wire surface.When the additive concentration was lower,its effect on diamond reunion was not obvious.But when the additive concentration was too high,it would make sanding difficult,thus the amount of sand significantly reduced.Under the condition of this experiment,in order to meet the certain amount of sand,the optimum concentration of additive was 200—300mg/L.