200 °C operation of semiconductor power devices
James Bromstead, G. Bennett Weir, Wayne Johnson
Abstract
James Bromstead, G. Bennett Weir, Wayne Johnson
Abstract
There is a growing need for commercial and military power electronics to operate above 175 °C. Changes in operating parameters at 200 °C have been measured for three devices, an NPN bipolar junction transistor (BJT), an N‐channel insulated gate bipolar transistor (IGBT), and a N‐channel metal‐oxide‐semiconductor field effect transistor (MOSFET). Using the results of these changes, a power supply for 200 °C operation has been built for lifetime tresting of the IGBT and N‐MOSFET.
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There is a growing need for commercial and military power electronics to operate above 175 °C. Changes in operating parameters at 200 °C have been measured for three devices, an NPN bipolar junction transistor (BJT), an N‐channel insulated gate bipolar transistor (IGBT), and a N‐channel metal‐oxide‐semiconductor field effect transistor (MOSFET). Using the results of these changes, a power supply for 200 °C operation has been built for lifetime tresting of the IGBT and N‐MOSFET.
Key concepts: Insulated-gate bipolar transistor, MOSFET, Power semiconductor device, Bipolar junction transistor, Electrical engineering, Transistor, Power MOSFET, Current injection technique