Hans Tuinhout
Abstract
This paper presents a study on MOSFET transconductance mismatch characterisation using MOSFET pairs with intentional 1% dimensional offsets. Furthermore, a new mismatch phenomenon is introduced that is attributed to mechanical strain associated with CMP dummy tiles.
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This paper presents a study on MOSFET transconductance mismatch characterisation using MOSFET pairs with intentional 1% dimensional offsets. Furthermore, a new mismatch phenomenon is introduced that is attributed to mechanical strain associated with CMP dummy tiles.
Key concepts: Transconductance, MOSFET, Materials science, Electronic engineering, Optoelectronics, Electrical engineering, Engineering, Transistor